間歇輪轉式濺鍍機Springon
【Introduction】
Industry : Semi/Optoelectronics/Electronics/
Features : High deposition rate/moving plasma magnetron
Application : Metal /Alloy/Oxide/Nitride/Carbide/ITO/Silicon/
適用產業：半導體/光電產業/電子業
機器特色：高鍍率/移動電漿磁控靶
適用場合：金屬 /合金/氧化物/氮化物/碳化物/透明導電薄膜/半導體材料
【Specification】
Chambers : 2V~4V
Substrate size : 550L*600W*70H (mm)
Cycle time : 40~60sec, depend on process require
Up time : 94%
Horizontal type
Target utilization : 40%
Uniformity : ± 5~12%
Ultimate vacuum: 5e-6mbar
桌上型濺鍍機eSputter/xSputter
【Introduction】
Industry : Lab tools for R&D sputtering only
Features : Desktop/ only 110V AC required
Application : DC Sputtering and reactive sputtering
適用產業：學術研發單位濺鍍薄膜應用最佳研發利器，最低預算，
最完整功能
機器特色：桌上型機種，只需110V 交流電即可動作
適用場合：金屬與反應式濺鍍鍍膜應用
【Specification】
Chambers : one process chamber
Substrate size : 4"~6"
Cycle time : 20 min depend on process
Application : Metal/Alloy/Oxide /Nitride/ITO/Silicon/Graphite....
Up time : 94%
Horizontal type
Target utilization : 25%
Uniformity : ± 2~8%
Footprint : 500*500*130H mm
【Option】
1. Plasma clean /reactive sputter
2. Heating plate up to 500 degree
3. Pre-sputter function
