间歇轮转式溅镀机Springon
【Introduction】
Industry : Semi/Optoelectronics/Electronics/
Features : High deposition rate/moving plasma magnetron
Application : Metal /Alloy/Oxide/Nitride/Carbide/ITO/Silicon/
适用产业：半导体/光电产业/电子业
机器特色：高镀率/移动电浆磁控靶
适用场合：金属 /合金/氧化物/氮化物/碳化物/透明导电薄膜/半导体材料
【Specification】
Chambers : 2V~4V
Substrate size : 550L*600W*70H (mm)
Cycle time : 40~60sec, depend on process require
Up time : 94%
Horizontal type
Target utilization : 40%
Uniformity : ± 5~12%
Ultimate vacuum: 5e-6mbar
桌上型溅镀机eSputter/xSputter
【Introduction】
Industry : Lab tools for R&D sputtering only
Features : Desktop/ only 110V AC required
Application : DC Sputtering and reactive sputtering
适用产业：学术研发单位溅镀薄膜应用最佳研发利器，最低预算，
最完整功能
机器特色：桌上型机种，只需110V 交流电即可动作
适用场合：金属与反应式溅镀镀膜应用
【Specification】
Chambers : one process chamber
Substrate size : 4"~6"
Cycle time : 20 min depend on process
Application : Metal/Alloy/Oxide /Nitride/ITO/Silicon/Graphite....
Up time : 94%
Horizontal type
Target utilization : 25%
Uniformity : ± 2~8%
Footprint : 500*500*130H mm
【Option】
1. Plasma clean /reactive sputter
2. Heating plate up to 500 degree
3. Pre-sputter function
