枚葉轉盤式濺鍍機Springon
【Introduction】
Industry : EMI coating/ Cosmetic coating
Features : High deposition rate
Application : Metal thin film sputtering for EMI
適用產業：EMI 鍍膜/SDC 外觀鍍膜
機器特色：高鍍率/移動電漿磁控靶
適用場合：金屬鍍膜應用
【Specification】
Chambers : 2V~4V
Substrate size : 550L*480W*50H (mm)
Cycle time : 40~60sec, depend on process require
Application : Al/Cu/SS/Cr...
Up time : 94%
Vertical / Horizontal type
Target utilization : 40%
Uniformity : ± 5~12%
枚葉轉盤式濺鍍機Apollogon
【Introduction】
Industry : Sputtering for photoelectric industry
Features : High deposition rate and High
uniformity
Application : ITO/CIGS/Ag coating、reactive
sputtering
適用產業：光電產業鍍膜
機器特色：高鍍率、高均勻度、高靶材利用率
適用場合：ITO/CIGS鍍膜、貴重金屬鍍膜應用、反應式鍍膜應用
【Specification】
Chambers : 2V//4V
Substrate size : 480L*330W*5H (mm)
Cycle time : 12~30sec
Application : ITO/CIGS/Ag/SiO2/TiO2
Up time : 94%
Vertical / Horizontal type
Target utilization : 60%
Uniformity : ± 5%
簡易多層膜實驗型濺鍍機eSputter
【Introduction】
Industry : Lab tools for R&D sputtering only
Features : Simple and multi-Layers function
Application : sputtering and reactive sputtering
適用產業：學術研發單位濺鍍薄膜應用最佳研發利器，最低預算，
最完整功能
機器特色：專利簡易多層膜機種，提高研發效率，全台獨家供應
適用場合：金屬與反應式濺鍍鍍膜應用
【Specification】
Chambers : one process chamber and one load/unload chamber
Substrate size : 4"~6"
Cycle time : 2min depend on process
Application : Al/Cu/SS/Cr/SiO2/TiN/ITO/Silicon/Graphite....
Up time : 94%
Horizontal type
Target utilization : 25%
Uniformity : ± 2~7%
footprint : 770*780*1219mm
【Option】
1. plasma clean
2. heating plate up to 800 degree
