枚叶转盘式溅镀机Springon
【Introduction】
Industry : EMI coating/ Cosmetic coating
Features : High deposition rate
Application : Metal thin film sputtering for EMI
适用产业：EMI 镀膜/SDC 外观镀膜
机器特色：高镀率/移动电浆磁控靶
适用场合：金属镀膜应用
【Specification】
Chambers : 2V~4V
Substrate size : 550L*480W*50H (mm)
Cycle time : 40~60sec, depend on process require
Application : Al/Cu/SS/Cr...
Up time : 94%
Vertical / Horizontal type
Target utilization : 40%
Uniformity : ± 5~12%
枚叶转盘式溅镀机Apollogon
【Introduction】
Industry : Sputtering for photoelectric industry
Features : High deposition rate and High
uniformity
Application : ITO/CIGS/Ag coating、reactive
sputtering
适用产业：光电产业镀膜
机器特色：高镀率、高均匀度、高靶材利用率
适用场合：ITO/CIGS镀膜、贵重金属镀膜应用、反应式镀膜应用
【Specification】
Chambers : 2V//4V
Substrate size : 480L*330W*5H (mm)
Cycle time : 12~30sec
Application : ITO/CIGS/Ag/SiO2/TiO2
Up time : 94%
Vertical / Horizontal type
Target utilization : 60%
Uniformity : ± 5%
简易多层膜实验型溅镀机eSputter
【Introduction】
Industry : Lab tools for R&D sputtering only
Features : Simple and multi-Layers function
Application : sputtering and reactive sputtering
适用产业：学术研发单位溅镀薄膜应用最佳研发利器，最低预算，
最完整功能
机器特色：专利简易多层膜机种，提高研发效率，全台独家供应
适用场合：金属与反应式溅镀镀膜应用
【Specification】
Chambers : one process chamber and one load/unload chamber
Substrate size : 4"~6"
Cycle time : 2min depend on process
Application : Al/Cu/SS/Cr/SiO2/TiN/ITO/Silicon/Graphite....
Up time : 94%
Horizontal type
Target utilization : 25%
Uniformity : ± 2~7%
footprint : 770*780*1219mm
【Option】
1. plasma clean
2. heating plate up to 800 degree
