兆陽真空動力股份有限公司sales@megaenergy.com.tw

產品

簡易多層膜實驗型濺鍍機eSputter

電洽

【Introduction
Industry : Lab tools for R&D sputtering only
Features : Simple and multi-Layers function 
Application : sputtering and reactive sputtering










適用產業學術研發單位濺鍍薄膜應用最佳研發利器,最低預算,
                                      最完整功能
機器特色
專利簡易多層膜機種,提高研發效率,全台獨家供應
適用場合
金屬與反應式濺鍍鍍膜應用


Specification
Chambers one process chamber and one load/unload chamber
Substrate size : 4"~6" 
Cycle time : 2min depend on process
Application : Al/Cu/SS/Cr/SiO2/
TiN/ITO/Silicon/Graphite....
Up time : 94%
Horizontal type
Target utilization : 25%
Uniformity : ± 2~7%
footprint : 
770*780*1219mm


【Option
1. plasma clean 
2. heating plate up to 800 degree