簡易多層膜實驗型濺鍍機eSputter
電洽
【Introduction】
Industry : Lab tools for R&D sputtering only
Features : Simple and multi-Layers function
Application : sputtering and reactive sputtering
適用產業:學術研發單位濺鍍薄膜應用最佳研發利器,最低預算,
最完整功能
機器特色:專利簡易多層膜機種,提高研發效率,全台獨家供應
適用場合:金屬與反應式濺鍍鍍膜應用
【Specification】
Chambers : one process chamber and one load/unload chamber
Substrate size : 4"~6"
Cycle time : 2min depend on process
Application : Al/Cu/SS/Cr/SiO2/TiN/ITO/Silicon/Graphite....
Up time : 94%
Horizontal type
Target utilization : 25%
Uniformity : ± 2~7%
footprint : 770*780*1219mm
【Option】
1. plasma clean
2. heating plate up to 800 degree